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37 Boothroyd, G, Fundamentals of Metal Machining and Machine Tools, International Student Edition, McGrawHill International Book Company, Tokyo, 1981 38 Lindberg, RA, Lecture at Ford Foundation Summer School, PSG College of Technology, Coimbatore, India, 1965 39 Mon, T T, Chemical Mechanical Polishing of Optical Glass Subjected to Partial Ductile Grinding, MEng Thesis, Universiti Teknologi Malaysia, 2003 40 Ohmori, H and Nakagawa, T, Mirror surface grinding of silicon wafers with electrolytic in-process dressing, Annals of the CIRP, 1990, 39(1): pp 329 332 41 Rahman M, Senthil Kumar S, Lim H S, Fatima K, Nano finish grinding of brittle materials using electrolytic in process dressing (ELID) technique, Sadhana, Indian Academy of Sciences 2003, Vol 28, pp 957 974 42 Bandyopadhyay, BP, Ohmori, H and Takahashi I, Efficient and stable grinding of ceramics by electrolytic in-dressing (ELID), Journal of Materials Processing Technology, 1997, 66: pp 18 24 43 Itoh, N and Ohmori, H, Grinding characteristics of hard and brittle materials by fine grain lapping wheels with ELID, Journal of Materials Processing Technology, 1996, 62: pp 315 320 44 Murata, R Okano, K and Tsutsumi, C, Grinding of structural ceramics, Milton C Shaw Grinding Symposium PED, 1985, 16: pp 261 272 45 Zhang C, Ohmori, H and Li, W, Small-hole machining of ceramic material with electrolytic intervaldressing (ELID-II) grinding, Journal of Material Processing Technology, 2000, 105: pp 284-293 46 Chen, H, Li, J, Spence, J and Li, JCM, An ELID-cutting saw, Journal of Materials Processing Technology, 2000, 102: pp 208 214 47 Qian, J, Ohmori, H and Lin, W, Internal mirror grinding with a metal/metal-resin bonded abrasive wheel, International Journal of Machine Tools & Manufacture, 2001, 41:pp193 208 48 Kapoor, A, A Study on Mechanism of Aspheric Grinding of Silicon, Tennessee Technological University, USA, MSc Thesis, 1993 49 Meister Darryl, Lens Talk, Sola technical marketing, 1998, Vol 26 No 25 50 Horne, DF, Optical Production Technology, 2nd Edition, Adam Hilger Ltd, Briston, 1983 51 Egger, JR, Manufacturing methods for large microstructured optical components for non-imaging applications, Proc SPIE, Vol 2600, pp 28-33, Design, Fabrication, and Applications of Precision Plastic Optics; Ning Alwz, Herber Raymond T; Eds December 1995 52 Evans, C, Precision Engineering: An Evolutionary View, Cranfield Press, Bedford, England, 1989 Bausch, C L, Diamonds as metal cutting tools, Transactions of the American Society of Mechanical Engineers, 1929, Vol 51, pp 125 128 53 Benjamin, RJ, Diamond turning at a large optical manufacturer, Optical Engineering, 1978, Vol 17(6), pp 574 577 54 Tan, CP, Aspheric Surface Grinding and Polishing of Thermal Imaging Materials, MSc Thesis, Tennessee Technological University, Cookeville, USA, 1990 55 Lewis, TG, Machining to millionths, The Tool and Manufacturing Engineer, 1962, 49(2), pp 65 68 56 Herbert, S, A marriage of success, Industrial Diamond Review, 1972, pp 375-378.

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How to Generate Code 128 Barcode in RDLC Reports
RDLC reports, created by the Visual Studio ReportViewer control based on Report Definition Language Client Side, are local reports and completely run in local ...

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Two methods of inspecting the innerlayers of multilayer panels exist. One that has been used for several years is x-ray. This technology has progressed significantly and is widely used.

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Step 1: For the Basic of RDLS report follow this link: Create RDLC report. Step 2: Download the bar code font 3 of 9 from this site: Barcode Font.

X-Ray X-ray technology is used to inspect the innerlayers of multilayer PCBs and to verify that the drill pads are located properly. Innerlayer shift is identified easily in an x-ray image, and a simple technique can be used to measure the misalignment accurately. In developing the PCB artwork, a set of stacked pads are located in the coupon area. These are inspected and a bestfit centering is calculated. X-ray inspection also is used to determine movement of each individual layer. In this case, a locating pad with a corresponding layer pad is on each individual layer. The system can measure the distance from the locating to layer pad and determine movement of each layer due to the location of the layer pads. PCBs can be inspected after tooling holes are drilled to verify that they are in the proper locations. In addition, x-ray inspection can be performed after final drilling to verify that the holes are centered within the pads.

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Jun 4, 2014 · The tutorial explains how to generate Code 128 barcodes in Visual Studio using barcode fonts ...Duration: 8:15 Posted: Jun 4, 2014

Direct Vision Using direct vision technology, the drilling machine opens a conical hole in the board s outer coupon area (or interior if space is available) and physically examines it with the help of an autofocus/autozoom camera at the copper traces exposed by the cut. These traces represent the various layers and can be measured to indicate their x and y variance from nominal. This is done for each internal layer, and algorithms are applied to generate a new drilling program that will provide for a best-fit drilling scenario. 25.7.2.1 Overview. The autofocus/autozoom camera looks at fiducial targets that are a cross pattern of traces spaced larger than the diameter of the tool used to drill the targets. The cross target should be repeated as a pattern shown in Fig. 25.6 to enable multiple depth cuts for thick panels. 25.7.2.2 Process. This pattern should be stacked on each internal layer and placed outside the circuitry. It is recommended that the patterns be as close to the circuitry as possible without interference to gather the best possible layer movement data.

It is also recommended that this pattern be repeated around the circuitry in four places around the corners to enable the most flexible selection of analysis algorithms as described in the discussion of analysis later in this section. With thick boards, all of the layers may not be visible with one countersink hole. The conical part of the drill bit is the only part where layers are exposed. The tip of the drill does not expose the layer adjacent due to alcohol residue during the cleaning process. Repeat entries at progressive depths expose all of the internal layers, as shown in Fig. 25.7. After the conical holes are drilled, an automatic alcohol sprayer is activated to clean debris caused by the drilling process. The camera then activates its autofocus/autozoom mode to close in on the subject area. Figure 25.8 shows the image created by the camera on the first conical hole. You can see the copper layers and some of the movement in the innerlayers.

The operator sets the area in which the analysis software should attempt to locate the edges of the traces (see Fig. 25.9). These bounding boxes are mouse-controlled and should be wide enough to enclose all traces. Gray circles represent the layer for the system to search. The area inside a boundary where the gray circle crosses a trace is searched for trace edges. The analysis software then locates the trace edges and indicates them with hash marks (see Fig. 25.10). If any of these are incorrect, the operator can easily move the marks with the mouse.

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